As the world of technology advances and 5G technologies continue to evolve, researchers have already set their sights on the future with the development of 6G. However, one of the main challenges that need to be addressed in both 5G and 6G is the negative effects of operating at extremely high frequencies on wireless communications. Issues such as signal attenuation and interference become more prominent as frequencies reach the terahertz range, making it difficult to maintain signal integrity. While glass- and ceramic-based insulating materials are currently used to mitigate these issues, their high cost and complexity of fabrication make them less suitable for mass-produced devices that are necessary for high-end 6G technologies.
In an attempt to find a better alternative, a research team from the Tokyo Institute of Technology conducted a study on polyimides (PIs). These materials have been gaining attention for their suitability for high-frequency operation due to their excellent thermal stability, mechanical toughness, flexibility, lightweight, and favorable dielectric properties. Despite these promising qualities, the correlation between the molecular structure of PIs and their dielectric properties has not been fully established. This gap in knowledge hinders the design of materials for next-generation telecommunications devices.
The research team investigated the dielectric properties of 11 PIs with different molecular structures using a Fabry–Pérot resonator, a device capable of measuring dielectric properties in the 110–330 GHz range. The researchers measured the dielectric constant (Dk) and dissipation factor (Df) of the polyimides to evaluate their energy storage capabilities. The results showed that higher fluorine content in PIs led to lower Dk values, with perfluorinated polyimides exhibiting significantly lower Dk and smaller Df values compared to other polyimides. Additionally, the increase in Df was found to be negatively correlated with the polar fraction of the polymer’s mass, indicating a relationship between molecular structure and dielectric properties.
The findings of this study provide valuable insights into the dielectric qualities of PIs and could potentially pave the way for faster and more reliable telecommunications in the terahertz range. By identifying the best type of PIs for high-frequency applications, engineers may be able to overcome the challenges associated with operating at extremely high frequencies. Spectroscopic studies in the terahertz range will further enhance our understanding of the dielectric responses of different structural PIs, ultimately leading to the development of high-performance polymer-based insulating materials for 6G technologies.
The research on polyimides as potential insulating materials for 6G telecommunications shows promising results. By leveraging the unique properties of PIs and identifying the molecular structures that contribute to improved dielectric properties, researchers can enhance the performance of future telecommunications devices operating in the terahertz range. With continued research and innovation, we may soon witness the integration of polyimides into mass-produced devices, opening up new possibilities for high-speed and reliable communication technologies in the era of 6G.
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